Registration Open: CITC Semiconductor Packaging Program 2025
Are you working in—or aspiring to enter—the semiconductor industry? Then the CITC Semiconductor Packaging University Program 2025 offers you a unique opportunity to gain in-depth knowledge and hands-on experience in chip assembly and packaging.
This annual program, organized by Chip Integration Technology Center (CITC), bridges the gap between industry needs and workforce development. With contributions from leading companies like NXP, Nexperia, and knowledge institutions such as TU Delft and TNO, participants are trained by industry experts in both theoretical and practical aspects of semiconductor packaging.
What to expect:
- A deep dive into the final stages of chip manufacturing
- Theoretical modules on packaging design, photonic assemblies, testing and reliability
- Practical assignments hosted at CITC and semiconductor companies
- Focus on cutting-edge developments like system-on-chip, 5G antennas, sensors and more
Who can join?
- Professionals working in or interested in the semiconductor industry
- Participants from outside the sector may be asked to attend an admission interview
Interested?
Download the brochure for all details, or email info@citc.org to register or ask questions.
Don’t miss this opportunity to future-proof your skills in one of Europe’s most vital high-tech sectors.
