Meeting Your Peers Engineers #2: Sustainability in Chip Packaging
How is sustainability applied in Chip Packaging?
By popular demand, the High Tech Network Meetings are back in action. The second ‘Meeting Your Peers Engineers’ will be organized, during the Vibe of the Future Festival at the Noviotech Campus in Nijmegen!
These free gatherings are specially designed for all engineers working in Nijmegen and the surrounding areas at High Tech/Semicon companies. The goal is simple yet powerful: to meet each other, share knowledge, and stay informed about the latest developments in our sector.
For a week The Vibe of the Future Festival sets the stage for this innovative and diverse eco-system. This Meeting Your Peer Engineers will take place on Thursday, Sep 26, from 11:45 a.m. to 1:30 p.m. at the Noviotech Campus. This time, Chip Integration Technology Center (CITC) will be in the spotlight and provide the lunch. General Manager, Mark Luke Farrugia, will discuss CITC’s goals and one of their ambitions: Sustainability in Chip Packaging.
After this, guest speaker from TNO will explain the latest research into these sustainability topics within this field.
Program:
12:00 – 12:30 Walk in & Lunch
12:30 – 12:40 Mark Luke Farrugia (General Manager) about CITC
12:40 – 13:40 In-depth presentations from:
- Edsger Smits, Program Manager Power Packaging at CITC
- Francesca Chiappini, Program Manager RF Chips Packaging at CITC
- Stephan Harkema, Top Senior Scientist at TNO
13:40 – 13:45 Wrap-up & introduction next meeting
Don’t miss this opportunity to network and expand your knowledge! Sign up quickly and reserve your spot on Sep 26st. It will be an inspiring and valuable session that you won’t want to miss!
Sign up here.