The European Packaging, Assembly, and Test Workshop 2023 took place on September 6-7 in Nijmegen, the Netherlands.
Organized by Sencio BV, Oliver Maiwald and Steffen Kröhnert the event aimed to foster collaboration and mutual engagement across the semiconductor packaging supply chain.
Key discussions included market trends, industry capabilities, and advocacy efforts aimed at strengthening the European semiconductor packaging ecosystem.
An exhibition space offered companies a platform to showcase
their innovations and services. Alongside the technical sessions, attendees had opportunities for networking and business development, capped off by a social evening event for more informal interactions.
With a range of registration options, including special packages for ESiPAT-TC members, the event was accessible to professionals at various stages of their career. Keep an eye out for future editions of this increasingly significant European workshop.
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